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Thermal Elixer 2
The new Scythe Thermal Elixer 2 provides excellent heat transfer between the processor and heat sink without compromising the application. High-quality ingredients in combination with the Pure Aluminum Particle Hybrid technology reduce the thermal resistance significantly and allow a convenient and controlled application. It has an excellent long-term stability and has no electrically conductivity under normal use. The applied thermal grease is ready to be used right away and no “burn-in” time is required.
Product Pictures
Features
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Excellent Cooling Performance
With the focus on the PC sector Pure Aluminum Particle Hybrid Technology is used to optimize the heat transfer between CPU and heat sink. The Thermal Elixer 2 has a very high thermal conductivity and low thermal resistance. A special additive composition provides an excellent long-term stability and extremely low dry-out characteristics.
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Easy to Apply
The consistency allows easy and economic application. Even removing the applied thermal grease is easily. Furthermore, it has a very low dielectric constant / high dielectric strength and no corrosive properties. There is no risk of short circuit, even if the thermal compound covers electrically conductive components.
![](https://www.scythe-eu.com/wp-content/uploads/2020/09/Zeit.jpg.pagespeed.ce.1tnTl8f-3r.jpg)
No "burn-in" time
The Thermal Elixer 2 reaches its maximum potential immediately after applying. It does not require large time periods to provide maximum cooling performance.
Specification
- Model Name
- Scythe Thermal Elixer 2 Thermal Grease
- Model Number
- SCTE-2000
- Weight
- 5 g / content
- Thermal Resistance
- 0,013 K-in² / W
- Thermal Conductivity
- 3,5 W/ (mK)
- Temperature Range
- -20° ~ 120°C
- Dielectric Strength
- 1,5 KV / mm
- Ingredients
- Aluminum (~ 70%) Zinc Oxide (~ 20%)