@IVOTA
Appendix:
My computer use idle 215W.
PSU efficency 0.85= 185W 30W leave by fan (this one also pulling out air)
CPU idle: 15W Grafic card idle: 70W.The rest mostly motherboard by SB and NB.Totally when I test with OCCT Normal/Medium Data Set and Hyperthreading it increases to 355W.This, all heat, has to be taken away or the temp of the CPU will rise as the air temp rises.
The test bench they use in tests are open so you think,well they have all the cool air they need.Yes but I have tried with an open chassi and the CPU only got hotter.Thats why I made the conclusion the need of cooling all parts the way I do.
Another thing about conductive paste.For the Scuthe I used theirs but the NB I used Arctic Silver 5.High silver content and of my knowledge the best but take some time to "break in" up to 200h with several stop and start
cycles.
Thermal Conductance Element Name Symbol
4.29 W/cmK Silver Ag 2.37 W/cmK Aluminum Al
4.01 W/cmK Copper Cu 2.01 W/cmK Calcium Ca
3.17 W/cmK Gold Au 2.01 W/cmK Beryllium Be
Quote and pictures from forum.
The example image below is of a few frozen peas beside a small BB size drop of OCZ Freeze TIM.
The image beside it is of the same cooler two hourslater after we completed testing. If there was ever any real advice that
applies to every situation,it would be that thermal paste isn't meant to
separate the two surfaces but rather fill the microscopic pits where
metal to metal contact isn't possible.
Try check default settings for i7 940, check temp (it will be over 70C).
Already done the result and check post<<<>>> 3.07GHz 23x....
http://www.scythe-eu.com/forum/showthread.php?p=8624
Click Me!
The last 3 using Everest. To me this is good enough considering I will not be doing anything that can use more power, don't know what that could be.
I hope this makes sence.
AiAiAi