I am interested in fanless heatsink operation.....that's why I ask about "heatlane" technology. In my opinion.....the original heatlane design was flawed, in that the heatlane did not have very good contact with the copper heatsink base. A new implementation of this design should have the heatlane itself, making direct contact with the CPU heat spreader (much like newer heatpipe designs).
The first time I assembled my NCU1000 (I think thats the model #), I could see that the heat transfer between the base and the heatlane assembly could be improved. I still have this heatsink.....and tried it out recently on a P4-3.4. Even with the addition of a 120mm fan, it's performance is lacking.
But I think it could be made to work better than a similar sized heat-pipe model......and could make true fanless operation on newer chips, a real possibility. I for one, am willing to pay the price for such an improved design.
