Kabuto 3

Designed to deliver uncompromised performance with compact dimensions and maximum compatibility, the Kabuto 3 expands the Scythe cooler portfolio with a new top-flow model. Based on the experience with its predecessor and extensive customer feedback, the main focus points during development were an improved cooling performance and user experience as well as noise reduction. Made from nickel-plated copper, the finely polished base plate is carefully manufactured to exactly fit the heatpipes. This improves heat transfer and the overall cooling performance significantly. A 120 mm PWM fan from the proven and reliable GlideStream series is included. As known from its predecessor, the top-flow design also supports the cooling of motherboard components such as the chipset, VRMs, and memory modules. The Easy Clip Mounting System allows simple, safe and fast installation.


Product Images. Click to enlarge

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Model Name:
Kabuto 3 CPU Cooler

Model Number:

EAN: 4571225055596

Socket LGA775
Socket LGA1150
Socket LGA1151
Socket LGA1155
Socket LGA1156
Socket LGA1366

Socket AM2
Socket AM2+
Socket AM3
Socket AM3+
Socket AM4
Socket FM1
Socket FM2
Socket FM2+

Overall Dimensions:
130 x 125 x 149 mm / 5.12 x 4.9 x 5.9(including fan - more details)

720 g / 25.4 oz (with fan)

2x Mounting clips (Intel), Mounting clip (AMD), 1x Mounting bar, 2x screws, 2x fan clips, Thermal paste, Installation manual

Baseplate Material:
Nickel-plated copper 38 x 41,5 mm (additional information)

Fan Specifications

Model Name:
GlideStream 120 PWM

Model Number:

Fan Dimensions:
120 x 120 x 25 mm / 4.72 x 4.72 x 0.98 inch

Noise Level:
4 ~ 28,0 dBA

Air Flow:
12.93 ~ 79.0 CFM - 21,96 ~ 113,34 m³/h

Fan Speed:
300 (±200 rpm) ~ 1.400 rpm (±10%) PWM

Static Pressure:
0,69 ~ 15,3 Pa / 0,07 ~ 1.56 mmH²O

Bearing Type:
Sleeve Bearing


15-03-2017 HardwareLUXX (German)
24-02-2017 TechPowerUp (English)
13-02-2017 Whatnext (Polish)
08-02-2017 (German)
31-10-2016 Freeocen (German)
13-07-2016 conseil-config (France)
26-05-2016 (German)


Maxedoutpctv (English)



Hybrid Heatpipes
Kabuto 3 uses a hybrid system which consists of two 6 mm and three 8 mm heatpipes. The nickel-plated copper base-plate is carefully manufactured to exactly fit the heatpipes, resulting in an improved heat transfer and an overall better performance.




The downward airflow ventilates not only the heatsink fins of Kabuto 3, but also cools VRMs, memory modules, as well as other components surrounding the processor socket. This helps to prevent heat accumulation and increases the mainboards lifetime.




Increased compatibility
Special design as well as the improved arrangement and shape of the heatpipes of Kabuto 3 allows mounting even in compact cases. The free space between motherboard and heatsink provides excellent compatibility to large memory modules or VRM coolers.